6 sigma capability
Laser-cutting
of Flexfoils
up to 500 mm/sec
High speed process up to 500 mm/sec.
Single or dual lane
In-line or off-line
Integrated product handling
Singulated parts can be directly
located into next process step
Quick-exchangeable gripper / handling systems
In process Vision Control System
Free programmable singulation contours
Requires no start holes/slots
Particle-free process (ionized air supported
vacuum dust collecting and separating systems)
CO
2
- Laser source
Galvo-Head beam control on multi-step XY-Manipulator
Advanced product handling
systems enable
Positive substrate location
during singulation process
leading to high accuracy,
clean cuts and
high throughput
Multiple gripper systems enable
manipulation of singulated
substrates to downstream
processes
placement / assembly into
final product
placement on conveyor
systems
segregation according to
passed / failed information
from upstream tester
Advanced product handling
systems
Multiple gripper systems