AVAILABLE

PROCESSES

·

Mechanical Assembly

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Large size parts

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Medium size parts

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Micro size parts

·

Insertion of leaded components

into Printed Circuit Boards

and onsertion of SMT-components

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Axial and radial components

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Tube components

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Bulk components

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Odd shape components

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Wires

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SMT-components

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Press-fit technology

·

Adhesive tape application

·

Lamination processes

·

Mechanical pre-assembly processes like

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Pin cutting

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Pin insertion

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Metal forming

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Press-fit connections

·

Liquid dispensing

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2 component silicone

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Epoxy

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Glue

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Flux

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Paint

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Expanding adhesive foam

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Screen printing (Solder paste)

·

Soldering systems

·

Depanelling Systems

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Routing

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Sawing

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Breaking

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Punching

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Laser cutting

·

Die bonding (incl. COB, FCT)

·

Wire bonding & encapsulation

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Wire bonding

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Tab bonding

·

Curing of liquids

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Thermal

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UV

·

Vision control system

·

Barcode printer / applicator

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Laser edging

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Ink jet

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Laser (CO2 / YAG / Diode laser)

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Cutting

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Trimming

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Engraving

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Soldering

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Welding

·

Testing process

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ICT

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Functional Test

(For Cellular Phones,

Airbag systems etc.)

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ESS Test

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Burn-in Test

·

MID-Processes

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Dispense of Solder

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SMT-Placement

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Laser soldering

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Assembly

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Plastic Molding

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Testing