Integration of any Bonding Technology
in standard process modules with advanced
material handling systems for high throughput production
·
Parallel bonding operation
·
Ultra-high precision positioning
(closed-loop vision control)
·
Automatic product change-over
·
Single or dual lane transport
·
Integration of fractual clean room
·
Process gas purging
·
In-line or off-line processing

Available Bonding Processes

·
Ultra sonic wire bond technology for
thin wire and heavy wire
·
Multi-chip die bonding
·
Multi-chip multi-placement bonders
for most complex hybrid applications
·
TAB bonding
·
Cure bonding
·
Tape bonding

Optional functions

·
Integrated heating sections
·
Vacuum bonding table on XY-Axis system
·
Carrier transport systems
·
Barcode/Dot matrix reader
·
Communication with host computer
·
Width adjustment
- Manual
- Motorized
- Fully automatic
Integrated Goldwirebonder
incl. by Pass Conveyor
AL-Bonder in
parallel operation incl.
Carrier Return Conveyor